WELCOME TO

EICCT 2027

Chengdu, China | April 16-18, 2027

The first International Conference on Electronics and Integrated Circuit Technology

Countdown to the Conference:

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About EICCT 2027

The first International Conference on Electronics and Integrated Circuit Technology (EICT 2022) was successfully taken place onFebruary 25-27, 2022 in Shenzhen, China. All accepted papers of EICT 2022 have been published by Journal of Physics: Conference Series (ISSN: 1742-6596) and has been indexed by EI Compendex, Scopus. The 2023 2nd International Conference on Electronics and Integrated Circuit Technology (EICT 2023) was successfully taken place on February 24-26, 2023 in Chengdu, China. All accepted papers of EICT 2023have been published by Journal of Physics: Conference Series (ISSN: 1742-6596) and has been indexed by EI Compendex, Scopus. The 2024 3rd International Conference on Electronics and Integrated Circuit Technology (EICT 2024) was successfully taken place on April 12-14, 2024 in Nanchang, China. All accepted papers of EICT 2024 have been published by Journal of Physics: Conference Series (ISSN: 1742-6596) and  has been indexed by EI Compendex, Scopus. The 2025 4th International Conference on Electronics, Integrated Circuits and Communication Technology (EICCT 2025) was successfully taken place on July 11-13, 2025 in Chengdu, China. All accepted papers of EICCT 2025 have been published by IEEE (ISBN: 979-8-3315-3594-0) and  has been indexed by EI Compendex, Scopus. The 2026 5th International Conference on Electronics, Integrated Circuits and Communication Technology (EICCT 2026) was successfully taken place on April 24-26, 2026 in Chengdu, China. 

The 2027 6th International Conference on Electronics, Integrated Circuits and Communication Technology (EICCT 2027) will be held in Chengdu, China, from April 16-18, 2027. This esteemed event strives to establish a forum where experts, scholars, engineers, and technical researchers from related fields can converge, sharing their scientific breakthroughs and innovative technologies. It aims to foster a deeper understanding of academic trends, broaden research horizons, and foster industrial collaboration that will propel academic achievements forward. We cordially invite you to be a part of this momentous academic gathering and eagerly anticipate your presence in Chengdu, China!

Integrated circuits and communications technology play a crucial role in the era of electronic information, and integrated circuits have now become a first-level discipline in China. In line with the trends of the times and in accordance with General Secretary Xi Jinping’s important directive—that “core technologies, key technologies, and national strategic assets must be based on our own capabilities”—and building upon the success of the previous five conferences, EICCT is set to host its sixth edition. We are honored to announce that the 2027 6th International Conference on Electronics, Integrated Circuits and Communication Technology (EICCT 2027) will be held in Chengdu, China, from April 16–18, 2027!

Electronics, integrated circuits, and communications technology are entering a new era of development. With the rapid advancement of emerging fields such as artificial intelligence, the Internet of Things, 5G communications, and quantum computing, the application potential of these technologies in interdisciplinary collaboration and cross-sector synergy continues to unfold. Amid this wave of technological evolution, breakthroughs in advanced manufacturing processes, optimizations in high-performance system design, and the integration of green and low-carbon technologies will inject powerful momentum into the industry’s development. EICCT 2027 is not only committed to bringing together the world’s leading scholars and industry experts to jointly explore these cutting-edge topics, but also aims to contribute wisdom and strength to the sustainable development of the integrated circuit and communications technology industries by establishing an international platform for academic exchange. We warmly welcome scholars from around the world to actively submit papers and participate in the conference, joining us in making this a grand event and together writing a new chapter in the fields of integrated circuits and microsystems!

Important Dates

Full Paper

Submission Date

February

01

2027

Notification of

Acceptance

March

01

2027

Registration

Deadline

April

01

2027

Final paper

Submission Date

March

16

2027

Conference

Dates

April

16-18

2027

Supported by

Sponsor

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☛ Call For Papers

☛ Submission

☛ Publication


Call For Papers

The topics of interest for submission include, but are not limited to:

📚︎Electronics and Information Technology

Power Electronics; Circuits and Electronics; Signals and Systems; Semiconductor Devices; Sensor Technology; Signal and Image Processing; Radar Engineering; Microelectronics and Solid-State Electronics; Electronics and Integrated Circuits; Analog and Digital Communications; Integrated Circuit Design and Integrated Systems; Electronic Information Engineering; Information and Communication Technology; Microelectronics; High-Frequency Technology and Communication Networks; Digital Signal Processing; Information and Remote Sensing Technology; Mobile Computing and Edge Computing; GPS and Wireless Positioning; Image Processing and Computer Vision; Audio and Speech Processing; Biomedical Signal Processing; Multimedia Signal Processing; Network and Information Security; Electronic Science and Technology; Data Structures; Analog Electronics

📚︎Integrated Circuits

Integrated Circuit Design and Manufacturing; Very Large-Scale Integration (VLSI); System-on-Chip (SoC) Design; Low-Power Design Techniques; Radio Frequency Integrated Circuits (RFICs); Power Management Integrated Circuits (PMICs); Digital Signal Processors (DSPs) and Applications; Digital Integrated Circuit Design; Analog and Mixed-Signal Circuit Design; High-Frequency (RF) and Microwave Circuit Design; Low-Power Circuit Design; Reconfigurable and Adaptive Circuit Design; Semiconductor Process Technology; Nanomanufacturing and Process Development; Packaging Technology and 3D Integrated Circuits; Chip Testing and Fault Diagnosis; Applications of Materials Science in Integrated Circuits; Applications of Artificial Intelligence and Machine Learning in Integrated Circuits; Integrated Circuit Solutions for Internet of Things (IoT) Devices; Automotive Electronics and Safety-Critical Systems; Integrated Circuit Applications in Consumer Electronics; Integrated Circuit Design for Biomedical Electronic Devices; Integrated Circuit Technology in Quantum and Neuromorphic Computing; Silicon Photonic Integrated Circuits; Applications of Novel Devices (e.g., Memristors) in Integrated Circuit Design; Security and Reliability of Integrated Circuits; Market Trends and Challenges in the Integrated Circuit Industry; Modular Design and System-Level Power Integration

📚︎Communication Technology

Wireless and Mobile Communications; 5G/6G Communication Technologies; Digital Communications; Multimedia Communications; Internet Communications; Optical Communications and Optical Networks; Satellite Communications and Space Communications; Mobile Internet and Terminals; RF Technology; Modern Switching Technology; Communications Electronic Circuits; Research on the Application of Signal Processing in Various Fields; Internet of Things (IoT) and Sensor Networks; Quantum Computing and Quantum Communications; Green Communications and Energy-Saving Technologies; Signals and Systems; Antennas and Electromagnetic Wave Propagation; Antenna Systems; Array Optimization; Wireless Communications; Applications of Intelligent Algorithms

Submission

1. The submitted papers must not be under consideration elsewhere.

2. Please send the full paper (Word+PDF) to Submission System.

📤︎Submission System (CN)📤︎Submission System (EN)

3. Please submit the full paper, if both presentation and publication are needed.

4. Please submit the abstract only, if you just want to make presentations.

5. Download Templates:

📥︎Download

6. Should you have any questions or need any materials in English, please contact us.

Publication

All accepted full papers will be published in the conference proceedings and will be submitted to EI Compendex / Scopus  for indexing.


EICCT 2026

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📚︎EI Compendex

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📚︎Scopus


EICCT 2025

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📚︎EI Compendex

2025 scopus检索.png

📚︎Scopus


EICT 2024

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📚︎EI Compendex

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📚︎Scopus


EICT 2023

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📚︎EI Compendex

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📚︎Scopus


EICT 2022

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📚︎EI Compendex

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📚︎Scopus


Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.

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