2024 3rd International Conference on Electronics and Integrated Circuit Technology(EICT 2024)

Welcome Assoc. Prof. Weimin Shi, Chongqing University , China to be the TPC!


Assoc. Prof. Weimin Shi, Chongqing University 


Weimin Shi received the Ph.D. degree from the University of Electronic Science and Technology of China, Chengdu, China, in 2019. From 2019 to 2021, he was a Post-Doctoral Research Fellow with the Department of Electrical and Computer Engineering, The Hong Kong University of Science and Technology (HKUST), Hong Kong. He is currently an Associate Professor with the School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China. His current research interests include board level power amplifiers, MMIC power amplifiers, and CMOS millimeter-Wave integrated circuit design. He has published more than 50 papers on top journals in recent years including IEEE TMTT, IEEE TIE, IEEE TCAS1, etc. He won the first place of the 2018 IEEE International Microwave Symposium Student Design Competition ‘14th High Efficiency Power Amplifier’. 

史卫民于2019年获电子科技大学博士学位,2019年至2021年在香港科技大学电子与计算机工程系从事博士后研究工作,现任重庆大学微电子与通信工程学院副教授。他目前的研究兴趣包括板级功率放大器,MMIC功率放大器和CMOS毫米波集成电路设计。近年来在IEEE TMTT、IEEE TIE、IEEE TCAS1等顶级期刊上发表论文50余篇。他获得了2018年IEEE国际微波研讨会学生设计比赛“第十四届高效功率放大器”第一名。