2024 3rd International Conference on Electronics and Integrated Circuit Technology(EICT 2024)

Welcome Assoc. Prof. Wen Yang, South China University of Technology, China to be the TPC!

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Assoc. Prof. Wen Yang, South China University of Technology, China 

杨文副教授,华南理工大学

  


Dr. Wen Yang received his Ph.D. degree in Electrical Engineering from the University of Central Florida in 2021, and then joined Analog Devices, Inc (ADI) as the Member of Technical Staff. His research interests include the reliability and failure analysis of wide-bandgap semiconductor power devices and integrated wide-bandgap semiconductor devices. He was the chair of the IEEE EDS Orlando Section and has published nearly 20 papers in top-tier journals and international conferences on the reliability of semiconductor devices, which including IEEE Transactions on Electron Devices (TED), Applied Physics Letters (APL), and IEEE International Reliability Physics Symposium (IRPS).

杨文,2021年于美国中佛罗里达大学电子工程专业获得哲学博士学位,随后加入美国Analog Devices, Inc.(ADI)担任研究员。主要研究方向为宽禁带功率半导体器件可靠性及失效分析、宽禁带功率半导体器件集成技术等。曾担任IEEE EDS Orlando Section主席,在微电子器件可靠性领域著名期刊IEEE Transactions on Electron Devices (TED), Applied Physics Letters (APL)和国际会议IEEE International Reliability Physics Symposium (IRPS)上发表论文近20篇。