Prof. Wenjie FengSouth China University of Technology, ChinaWenjie Feng, a Senior Member of IEEE, was born in Shangqiu, Henan, China, in 1985. He obtained his B.Sc. degree from the First Aeronautic College of the Airforce in Xinyang, China, in 2008, followed by his M.Sc. and Ph.D. degrees from Nanjing University of Science and Technology (NUST) in Nanjing, China, in 2010 and 2013, respectively. Between July and September 2017, Dr. Feng served as a Research Fellow at the City University of Hong Kong. Earlier, from October 2010 to March 2011, he was an Exchange Student at the Institute of High Frequency Engineering at Technische Universität München in Munich, Germany. Presently, he holds the position of Professor at South China University of Technology in Guangzhou, China. Dr. Feng has established himself as a prolific author, having contributed to over 100 IEEE journal articles, including 70 published in IEEE TRANSACTIONS, and 80 conference papers. His research focuses on diverse areas such as wideband circuits and technologies, microwave and millimeter-wave circuits and components, circuit interconnection, and packaging. His academic achievements have been recognized with several prestigious awards, including the National Science Fund for Excellent Young Scholars in 2018 and the Young Scientist Award of ACES-China in 2018. Additionally, Dr. Feng serves as a reviewer for over 20 internationally refereed journals and conferences, demonstrating his expertise and commitment to the academic community. Currently, he holds the position of Associate Editor for IET Microwaves, Antennas & Propagation, IET Electronics Letters, and International Journal of Electronics, further contributing to the advancement of his field. Title: Overview of W-band Gap Waveguide Circuit and System Abstract: Four Substrate Integrated Gap Waveguide (SI-GWG) antenna arrays and four SI-GWG components are summarized in this overview paper. The SI-GWG antenna arrays are all implemented on the substrate to achieve a light weight design for such as small unmanned aerial vehicle application. The SI-GWG bandpass filter is implemented using the Micro- Electromechanical System (MEMS) technique. The SI-GWG microstrip transitions are introduced here for system integration between the antenna and the active chips. The SI-GWG packaging lid is designed by 3-D printing technique. Finally, the future development of the SI-GWG is given in the Conclusion. |
Prof. Qiongfeng ShiSoutheast University, China (H-index: 48)Prof. Shi received his B.Eng. degree from the Department of Electronic Engineering and Information Science at the University of Science and Technology of China, and his Ph.D. degree from the Department of Electrical and Computer Engineering at the National University of Singapore (NUS). After that, he continued to conduct his postdoctoral research in the same department of NUS (2018-2022). His research interests include flexible electronics, energy harvesting, human-machine interfaces, MEMS and intelligent systems, focusing on device physics, structural design, performance optimization and system applications. Prof. Shi has published more than 80 journal papers, conducted invited/oral presentations more than 10 times at international conferences, and won one Best Conference Paper Award and one Best Poster Finalist Award. The published papers have been cited more than 7000 times with an H-index of 48. Title: Development of Multimodal Flexible Sensors for Robotic E-Skin and Intelligent Perception System Abstract: Robotic multimodal electronic skin (e-skin), emulating the sensory functions of human skin, is pivotal for enabling robots to interact with their environment akin to human perception. Firstly, we developed a multifunctional silk-based nanocomposite incorporating Ca2+, H+ and MXene for biomimetic hyper-attribute-gel e-skin with reversible gel-solid transition. This e-skin exhibits a wide range of skin-like physical-chemical properties, including stretchability, self-healing, and antibacterial activities, alongside multimodal sensory capabilities such as pressure, temperature, and humidity sensing, as well as function reconfigurability and evolvability. To decouple the sensing information from each modality in the multimodal sensor, we then proposed a skin-like structural design with a vertical high-low-modulus hierarchical configuration. This structure leads to deformation concentrating in the low-modulus pressure sensing part and thus enables pressure insensitivity of the thermistor. Besides, the bionic dual-state amplifying microstructure and contact resistance modulation endow the robotic e-skin with high sensitivity over a wide pressure range and excellent temperature insensitivity (91.2% reduction). With the developed multimodal sensors, we proposed a soft robotic perception system that integrates tactile e-skin, finger-bending sensors and an ultrasonic sensor. The perception system can achieve remote object positioning and multimodal cognition, which facilitates highly accurate object identification through deep-learning analytics. We envision that the development of multimodal flexible sensors represents a significant advancement in the area of robotic e-skin and intelligent perception system, promoting applications across robotics, prosthetics, and wearable technologies. |
Prof. Wu GaoNorthwestern Polytechnical University, ChinaDr. Wu GAO is an Integrated Circuits Professor at Northwestern Polytechnical University's School of Computer Science (NPU). He began working at NPU in 2011 after receiving his Ph.D. in Microelectronics from the University of Strasbourg in France. He got his B.S. and M.S. degrees in computer science and technology from NPU in Xi'an, Shaanxi Province, from 2000 to 2007. He worked at NPU as an associate professor in the department of computer systems and microelectronics from 2012 until 2016. He has been a full professor at NPU's School of Computer Science and Technology since 2016. Since 2020, he serves as the director of Interdisciplinary Research Center of Bio-inspired System-on-Chip, NPU. Dr. Gao's research interests include computer architecture, mixed-signal IC design, and integrated circuit reliability. He has authored or co-authored more than 60 papers and two books. He has been on the editorial boards of over ten journals, including IEEE Trans. on Circuits and Systems-I, IEEE Trans. on Nuclear Science, IEEE Sensors Journal, and Microelectronics Journal. He is a member of the IEEE, the Chinese Computer Society's integrated group, and the Chinese Nuclear Society's radiation detection microelectronics group. He was a co-recipient (the first author) of the IEEE Society of Instrumentation and Measurement's Andy-Chi Best Paper Award in 2013. In 2016, he was named Shaanxi Province's Young Science and Technology Star. In 2020, he was supported by the Outstanding Youth Project of Shaanxi Province. In 2021, he was named to the National Special Plan for Young Top-Notch Talent. Title:Coming soon...... Abstract: Coming soon...... |
Prof. Chonghua Fang (Senior Engineer)Dohitech, ChinaChonghua Fang has taken on and actively participated in numerous national major (key) scientific research projects, encompassing prestigious programs such as the 973 Program, 863 Program, Zhuangfa, and the National Natural Science Foundation of China. His prolific academic contributions have resulted in the publication of over 100 academic papers, a testament to his depth of knowledge and research expertise. Furthermore, Fang has secured more than 20 invention patents, with 10 of them being attributed to him as the primary inventor. Notably, several of these patents have been successfully translated into practical applications, leading to tangible economic benefits for equipment design. This achievement underscores his ability to bridge the gap between theoretical research and practical applications. Additionally, Fang has obtained four computer software copyright registrations, two of which he holds as the primary applicant. This diverse portfolio of intellectual property demonstrates his breadth of knowledge and innovation in the field of computer software. Title: Calculation and Analysis of Quantum Radar Scattering Abstract: Quantum radar offers the prospect of detecting, identifying, and resolving RF stealth platforms and weapons systems, but the corresponding quantum radar cross section (QRCS) simulation is restricted-almost all existing methods can only be used for the two-dimensional (2-D) targets, not the 3-D targets even for convex targets. We propose a novel method that can deal with the calculation of the orthogonal projected area (A ⊥ ) of the target in each incidence, which is the key part of QRCS simulation for the arbitrary 3-D convex target. To the best of our knowledge, this has not been reported before. In this report, we introduce a three-step computation process of (A ⊥ ), and verified the method for typical 2-D targets. Finally, we show some results for typical 3-D convex targets and compared the QRCS with classical radar cross section (CRCS). Meanwhile, we analyze the superposition of quantum effect of side lobes which means a kind of novel quantum phenomena. |