2026 5<sup>th</sup> International Conference on Electronics, Integrated Circuits and Communication Technology (EICCT 2026)

2026 5^th International Conference on Electronics, Integrated Circuits and Communication Technology (EICCT 2026)

Speakers of EICCT 2026

	Bo Ai Vice President, IEEE Fellow Beijing Jiaotong University, China Bo Ai currently serves as a Standing Committee Member of the Party Committee and Vice President of Beijing Jiaotong University. In 2017, he was awarded the National Science Fund for Distinguished Young Scholars. In the same year, he was selected into the National Ten Thousand Talents Program (Leading Talents) by the Organization Department of the CPC Central Committee. He is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE Fellow), a Fellow of the International Academy of Automation and Artificial Intelligence (AAIA Fellow), and a Fellow of the Institution of Engineering and Technology (IET Fellow). He holds the positions of Council Member of the Chinese Institute of Electronics (CIE), Deputy Director of the Intelligent Transportation Information Engineering Branch of CIE, and Deputy Director of the Communications Branch of CIE. His previous appointments include serving as a teacher at the Engineering College of the Chinese People's Armed Police Force, a postdoctoral researcher in the Department of Electronic Engineering at Tsinghua University, a teacher at the School of Electronic and Information Engineering of Beijing Jiaotong University, a teacher at the State Key Laboratory of Rail Traffic Control and Safety, Deputy Secretary and Deputy Dean of the School of Electronic and Information Engineering, and Dean of the School of Electronic and Information Engineering. From March to September 2015, he was a visiting senior research scholar in the Department of Electrical Engineering at Stanford University, USA. In 2016, he was selected as a leading innovative talent in science and technology among middle-aged and young scientists by the Ministry of Science and Technology of China. From 2020 to 2022, he was consecutively listed among the World's Top 2% Most Cited Scientists. In 2022, he became the leader of an innovative research group supported by the National Natural Science Foundation of China. Bo Ai is dedicated to research in broadband mobile communication systems, dedicated mobile communication, communication engineering, and artificial intelligence.
	Pingyi Fan Member of NAAI, Winner of NAAI 2025 AI Exploration Award, IET Fellow Tsinghua University,China He is a tenured professor in the Department of Electronic Engineering at Tsinghua University, Director of the Open Source Data Cognitive Innovation Center, a Member (Academician) of the United States National Academy of Artificial Intelligence (US-NAAI) and the recipient of the NAAI 2025 AI Exploration Award & Outstanding Scientist Award, theCo-Chair of the Academic Committee of the NAAI Institute for Asia, the IET Fellow, and a member of the International Review Committee of IET Fellows. He received his Ph.D. from the Department of Electronic Engineering of Tsinghua University in 1994 and stayed on to teach. He has published more than 600 academic papers, including 181 IEEE journals and 16 ESI highly cited papers. He has applied for more than 40 national patents, 7 international patents, and published 5 academic works. He has won the Best Paper Award at 16 IEEE and other international conferences, including IEEE ICCCS 2024, ICC2020, and Globecom2014, the IEEE TAOS 2020 Best Paper Award, the 2024 High Impact Paper Award from the Chinese Journal of Electronics (CJE) of the Chinese Institute of Electronics, and the IEEE DCASE2024 Challenge Judge’s Award (DCASE2024 Challenge), AEIC (2023) Most Popular Scholar Award, IEEE TWC (2009) Excellent Editor Award, etc. He is currently on the editorial board of IEEE Transactions on Cognitive Communications and Networking (TCCN) (2024-2026), the editorial board of IAES international Journal of Artificial Intelligence (IJAI) (2023-2026), MDPI Section Editor-in-Chief of Electronics (2025-2027), The Chair of China 6G-ANA TG4 , etc. He has served as the General Chair, TPC Chairman or the Keynote Speaker more than 40 times at international conferences. His main research interests include 6G wireless communication networks and machine learning, semantic information theory and big data processing theory, and intelligent network and system detection.
	Hua Fan National Young Academic, IEEE Senior Member University of Electronic Science and Technology of China, China
	She is a national-level young talent, recipient of the China-France Young Scientist Award from the Ministry of Science and Technology, and holds a PhD from Tsinghua University as well as a postdoctoral fellowship from the University of Pavia, Italy. Currently, she is a professor and doctoral supervisor at the School of Integrated Circuits Science and Engineering, University of Electronic Science and Technology of China (UESTC). She is a Senior Member of IEEE and serves as an Associate Editor for IEEE Transactions on Circuits and Systems II: Express Briefs. As the first author, she has published 32 SCI-indexed papers in top journals in the fields of circuits and systems, including IEEE TCAS-I, IEEE TCAS-II, and IEEE Sensors Journal. As the first inventor, she has been granted 5 US patents, 1 UK patent, and 45 Chinese patents. Her achievements include being a finalist with an outstanding project in the “Chunhui Cup” Innovation and Entrepreneurship Competition for Chinese Overseas Students organized by the Ministry of Education; recognized as a role model in Chengdu for outstanding women’s contributions; awarded the Gold Prize with the highest national score in the national finals of the “1st National Postdoctoral Innovation and Entrepreneurship Competition”; recipient of the Special Prize in the Guangdong “Maker Cup” Technology Returnees Entrepreneurship and Innovation Competition; and winner of the Excellence Award in the finals of the 2nd “Pioneer Cup” Future Technology Innovation Competition. Her main research interests include analog and mixed-signal design, sensor chip design, and analog-to-digital converter (ADC) chip design.